Title:
セラミックス回路基板、電子デバイス、金属部材、及びセラミックス回路基板の製造方法
Document Type and Number:
Japanese Patent JP7208439
Kind Code:
B2
Abstract:
Provided is a ceramic circuit board formed by joining a plate-shaped metal member to at least one surface of a ceramic board (10) by means of a brazing material (20), wherein the metal member (30) has a first surface (31) which faces the ceramic board (10) and a second surface (32) which is the opposite surface from the first surface (31), and the first surface (31) has, in the outer edge portion (50) thereof, a roughened portion (52) having a higher surface roughness than the center portion (51) of the first surface (31).
More Like This:
| JPH1027865 | SEMICONDUCTOR SUBSTRATE |
| JP5278149 | Circuit board and circuit module |
Inventors:
Ryota Aono
Minoru Ushijima
Junichi Tanaka
Tatsuo Saruwatari
Minoru Ushijima
Junichi Tanaka
Tatsuo Saruwatari
Application Number:
JP2022512196A
Publication Date:
January 18, 2023
Filing Date:
March 29, 2021
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
H01L23/12; B23K1/00; B23K1/19; H01L23/13; H01L25/07; H01L25/18
Domestic Patent References:
| JP2007311527A | ||||
| JP2012169318A | ||||
| JP5136290A |
Attorney, Agent or Firm:
Shinji Hayami