PURPOSE: To prevent breaking of a metal fine lead connecting between a ground terminal and a bed by connecting the ground terminal and the bed, with a metal plate, in a ceramic container for a semiconductor memory element.

CONSTITUTION: A ceramic container providing a bed at the center thereof, a semiconductor element fixed to this bed, electrodes formed on this semiconductor elements and lead terminals provided overlapped on the end portions of the ceramic container corresponding to the semiconductor element are provided. In particularly, a ground pin 9 provided on a circuit pattern is connected with a lead of the semiconductor memory element through a metal plate 10. Existing connection between the ground pin and the lead by extending a metal fine lead is replaced with connection by the metal plate 10. Thereby, breaking of the metal fine lead between the ground pin 9 provided on the circuit pattern and the bed and the edge touch of the metal fine lead can be prevented.