Title:
CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2022119088
Kind Code:
A
Abstract:
To suppress a crack while maintaining reliability.SOLUTION: In a case where a direction in which a first end surface and a second end surface of a lamination chip are opposite is an X-axis, a lamination direction is a Z-axis, a direction orthogonal to the X-axis and the Z-axis is a Y-axis, a curvature radius R1 is a curvature radius of a corner part on a first external part electrode side of a first cover layer in a cross section of a XZ plane passing through a center of the Y-axis of the lamination chip, a straight line obtained by connecting ends on the first external part electrode side of internal electrode layers which are not connected to the first external part electrode is a straight line L, an intersection point of the straight line L and the internal electrode layer nearest to the first cover layer is an intersection point N1, a straight line M is a straight line drawn in an X-axis direction so as to be in contact with an upper surface of the lamination chip, a straight line N is a straight line drawn in a Z-axis direction so as to be in contact with the first end surface, an intersection point of the straight line M and the straight line N is an intersection point O, a distance between the intersection point N1 and the straight line M is C1, and a distance between the intersection point N1 and the intersection point O is P1, a relationship of 0.20≤R1/√(P12-C12)≤0.80 is established.SELECTED DRAWING: Figure 5
Inventors:
TAWARA MIKIO
Application Number:
JP2021016082A
Publication Date:
August 16, 2022
Filing Date:
February 03, 2021
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G4/30
Attorney, Agent or Firm:
Shuhei Katayama