To provide a ceramic package and a manufacturing method thereof that can prevent a connection defect due to a decrease in connection strength of a wire-bonded wiring by preventing a lead frame from being contaminated with an adhesive made of resin used to join the package and fix the lead frame.

The ceramic package is used for housing a semiconductor device called an image sensor, and includes a planar base body 2 and frame body 3 made of sintered bodies of ceramic, and the lead frame 4 interposed between the base body 2 and frame body 3, wherein the base body 2 and frame body 3 are joined to each other using a joining body made of epoxy resin and a connection portion 10 to which the semiconductor device 5 is wire-bonded and a smooth portion 9 having smaller surface roughness than that of the connection portion 10 are formed at an end of an inner lead portion 4a.