To provide a ceramic wiring board that can effectively prevent the occurrence of solder bridging without compromising the certainty of soldering of individual pads when the arranging pitch of the pads is made finer.

This ceramic wiring board is formed in a state where a plurality of substrate-side terminal pads 155 respectively electrically connected to metallic wiring layers is arranged on the main surface of its main body 3 for surface-mounting an electronic component 100 through soldered connections 102. On the main surface of each terminal pad 155, a soldering area 156 coupled with a soldered connection 102 is formed and a solder block section 157 having lower solder wettability than the soldering area 156 has is formed in the circumference of the soldering area 156.