Title:
CERAMIC WIRING BOARD
Document Type and Number:
Japanese Patent JP3940590
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that plating solution or the like permeates being conducted along dividing trenches into a thick film circuit on a lower surface, and corrosion, exfoliation, etc., are generated on the thick film circuit when a plating metal layer is stuck on a metallized wiring conductor on an upper surface of a ceramic wiring board.
SOLUTION: In this ceramic wiring board 7, the dividing trenches 3 are formed on at least a lower surface of a ceramic mother board 1, a metallized wiring conductor 2 on which the plating metal layer is stuck is formed on an upper surface of a square region 1a sectioned by the dividing trenches 3, and a thick film circuit 4 which is coated with a protective glass layer 5 and a coating layer 6 composed of organic resin coating the glass layer 5 is formed on a lower surface. The dividing trenches 3 positioned outside the square region 1a of the ceramic mother board 1 are coated with coating material 8 composed of low melting point glass. As a result, permeation of plating solution or the like from the dividing trenches 3 in an outer peripheral part 1b into the thick film circuit 4 is effectively prevented, generation of corrosion, exfoliation, etc., can be prevented, and reliability of the ceramic wiring board 7 can be made superior.
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Inventors:
Hiroshige Ito
Mizuno Urano
Mizuno Urano
Application Number:
JP2001359651A
Publication Date:
July 04, 2007
Filing Date:
November 26, 2001
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/28; H05K1/02; H05K3/00; (IPC1-7): H05K3/28; H05K1/02
Domestic Patent References:
| JP1050190A | ||||
| JP11298122A | ||||
| JP870164A | ||||
| JP6283885A | ||||
| JP9139555A | ||||
| JP6188566A | ||||
| JP541579A |