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Title:
CERAMICS CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2001144433
Kind Code:
A
Abstract:

To provide a ceramics circuit board that can be applied to applications requiring high reliability.

In the ceramics circuit board, a metal plate that mainly consists of aluminum is bonded to at least one main surface of a ceramics substrate, and Mg is unevenly distributed at the junction interface between the metal plate and a brazing material layer or near the junction interface.


Inventors:
OGATA YOICHI
SUGIMOTO ISAO
UTO MANABU
NONOGAKI RYOZO
IBUKIYAMA MASAHIRO
Application Number:
JP32789499A
Publication Date:
May 25, 2001
Filing Date:
November 18, 1999
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
H05K3/38; C04B37/02; H01L23/14; H01L23/15; (IPC1-7): H05K3/38; C04B37/02; H01L23/15
Domestic Patent References:
JPH10178270A1998-06-30
JPH04363052A1992-12-15
JPH06120634A1994-04-28
JPH10298686A1998-11-10



 
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