Chamfering method of glass substrate and laser processing equipment

Title:

Chamfering method of glass substrate and laser processing equipment

Document Type and Number:

Japanese Patent JP6324719

Kind Code:

B2

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Inventors:

Tokutake Sajima
Seiji Shimizu
Murakami Masanao
Su Ukou

Application Number:

JP2013272148A

Publication Date:

May 16, 2018

Filing Date:

December 27, 2013

Export Citation:

Assignee:

Samsung Diamond Industry Co., Ltd.

International Classes:

C03B29/02; B23K26/08; B23K26/362; C03C23/00

Domestic Patent References:

Foreign References:

WO2009157319A1

Attorney, Agent or Firm:

Shinki Global IP Patent Corporation

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