CHEMICAL COPPER PLATING SOLUTION

Title:

CHEMICAL COPPER PLATING SOLUTION

Document Type and Number:

Japanese Patent JPS63134670

Kind Code:

A

Abstract:

PURPOSE: To provide fine-grained copper films causing no cracking to through holes, etc., by chemical plating by adding a carboxylic acid other than formic acid to a chemical copper plating soln. contg. formaldehyde.

CONSTITUTION: A proper amt. of a carboxylic acid other than formic acid, e.g., acetic acid is added to a chemical copper plating soln. contg. formaldehyde as an essential component. A fine-grained copper film having satisfactory physical properties is obtd. by chemical plating with the resulting plating soln. When the plating soln. is used to plate the through holes in a printed circuit board, a high density printed circuit board having a high degree of integration can be obtd.

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Inventors:

HYODO KIYOSHI
AEBA KEIJI
TSURU KAZUTO
AMADA TOYOMITSU

Application Number:

JP27870586A

Publication Date:

June 07, 1988

Filing Date:

November 25, 1986

Export Citation:

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Assignee:

FUJITSU LTD

International Classes:

C23C18/40; H05K3/18; H05K3/42; (IPC1-7): C23C18/40; H05K3/18; H05K3/42

Attorney, Agent or Firm:

Aoki Akira

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