To provide chemical mechanical polishing equipment wherein a platen can be rotated at a low speed with high precision, e.g. when a motor having high speed and low torque specifications is used.

A traction drive reducer 130 can transfer torque smoothly from a rotation shaft 124 of a motor 120 to the platen 140 by traction drive wherein engagement fluctuation like a gear is not generated, so that flatness of a polished wafer W is more increased. Since gears are not used, noise can be reduced. Constitution can be more miniaturized as compared with a case using a direct drive motor. Furthermore, in a case that a load of the platen 140 is increased, abutting force against reduced diameter cylindrical parts 124a in movable rollers 136B, 136C and against an external wheel 132 is increased, and rotation control constitution can be more simplified since increase in the slip ratio (holding member rotational speed is decreased relative to motor rotational speed) is excluded.