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Title:
CHEMICAL MECHANICAL POLISHING WATER DISPERSED MATERIAL
Document Type and Number:
Japanese Patent JP2001057351
Kind Code:
A
Abstract:

To provide a water dispersed material which is capable of polishing copper or the like at a high speed without making scratches on the surface of a polished work of copper or the like.

A water dispersed material that contains a polymer which is of crosslinked structure and has functional groups that form cations in its molecules or particles formed of copolymer and water is obtained. A polymer possessed of a functional group which forms cations can be produced by polymerizing methyl methacrylate or the like by the use of an azo-polymerization initiator possessed of the above functional group. Or, a polymer possessed of a functional group which forms cations can be produced by polymerizing methyl methacrylate or the like by the use of the above initiator in the presence of polystyrene. Furtheremore, a copolymer having a functional group which produces cations can be produced by it that a monomer such as 3-amino-2- hydroxypropyl methacrylate possessed of a specific functional group is copolymerized with methyl methacrylate.


Inventors:
MOTONARI MASAYUKI
HATTORI MASAYUKI
KAWAHASHI NOBUO
Application Number:
JP23166999A
Publication Date:
February 27, 2001
Filing Date:
August 18, 1999
Export Citation:
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Assignee:
JSR CORP
International Classes:
B24B37/00; C09K3/14; C09K13/00; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; C09K3/14; C09K13/00
Attorney, Agent or Firm:
Kojima Kiyoji