Title:
薬液供給装置及び供給装置
Document Type and Number:
Japanese Patent JP4362473
Kind Code:
B2
Abstract:
A chemical-solution supplying apparatus (100) for supplying slurry to an exterior device (7) includes a supply route (A) in which abrasive suspension flows at a predetermined flow rate and a return route (C) connecting the supply route and a storage tank (1). When the supply of the slurry to the exterior device is stopped, the abrasive suspension is returned from the supply route to the storage tank through the return route. This is done in order to maintain the flow of the abrasive suspension in the supply route so that abrasive is prevented from coagulating and settling.
Inventors:
Masataka Fukuizumi
Naoki Hiraoka
Yamamoto Hotaka
Tsuyoshi Nakamura
Yu Oshida
Matoba Toru
Naoki Hiraoka
Yamamoto Hotaka
Tsuyoshi Nakamura
Yu Oshida
Matoba Toru
Application Number:
JP2005500911A
Publication Date:
November 11, 2009
Filing Date:
June 20, 2003
Export Citation:
Assignee:
Fujitsu Microelectronics Limited
International Classes:
B24B57/02; A63H30/04; B01F25/60; B24B37/00; H01L21/304; H05K3/46; H05K1/03; H05K3/42
Domestic Patent References:
| JP2001150347A | ||||
| JP2001345296A | ||||
| JP2000218107A | ||||
| JP2000202774A |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda