To provide: a chemically amplified negative resist composition which can form a pattern simultaneously satisfying high sensitivity, high resolution (e.g., high resolving power, excellent pattern shape, and small line edge roughness (LER)) and satisfactory dry etching resistance, and which has excellent scum characteristics and excellent temporal stability; a resist film using the composition; a resist coated mask blank; a resist pattern forming method; and a photomask.
The chemically amplified negative resist composition contains (A) a compound represented by the specified general formula (I), (B) a compound having a phenolic hydroxyl group, (C) a compound to generate an acid by exposure to an actinic or radioactive ray, and (D) a crosslinking agent. In the general formula (I), each of R1 to R5 represents a hydrogen atom or a substituent. Two or more of R1 to R5 may be bound to each other to form a ring. A represents a monovalent organic group.
INAZAKI TAKESHI
TSURUTA TAKUYA
TAKAHASHI KOTARO
YAO TADATERU
Toshiyuki Ozawa
Hasegawa Hiromichi
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