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Title:
CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, RESIST FILM USING THE SAME, RESIST COATED MASK BLANK, RESIST PATTERN FORMING METHOD, AND PHOTOMASK
Document Type and Number:
Japanese Patent JP2013156388
Kind Code:
A
Abstract:

To provide: a chemically amplified negative resist composition which can form a pattern simultaneously satisfying high sensitivity, high resolution (e.g., high resolving power, excellent pattern shape, and small line edge roughness (LER)) and satisfactory dry etching resistance, and which has excellent scum characteristics and excellent temporal stability; a resist film using the composition; a resist coated mask blank; a resist pattern forming method; and a photomask.

The chemically amplified negative resist composition contains (A) a compound represented by the specified general formula (I), (B) a compound having a phenolic hydroxyl group, (C) a compound to generate an acid by exposure to an actinic or radioactive ray, and (D) a crosslinking agent. In the general formula (I), each of R1 to R5 represents a hydrogen atom or a substituent. Two or more of R1 to R5 may be bound to each other to form a ring. A represents a monovalent organic group.


Inventors:
TSUCHIMURA TOMOTAKA
INAZAKI TAKESHI
TSURUTA TAKUYA
TAKAHASHI KOTARO
YAO TADATERU
Application Number:
JP2012015968A
Publication Date:
August 15, 2013
Filing Date:
January 27, 2012
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/038; C08F12/24; G03F7/004; H01L21/027; C07C309/71; C07C309/73; C07C309/77; C07D217/08; C07D251/70; C07D285/00; C07D295/22; C07D327/08; C07D487/04
Attorney, Agent or Firm:
Takeshi Takamatsu
Toshiyuki Ozawa
Hasegawa Hiromichi