To provide a chemimechanical polisher incorporating a pressure control circuit.
This chemimechanical polisher comprises a pressure control circuit, and further comprises a rotary polishing platen, a slurry supply system for feeding slurry onto the outer surface of the rotary polishing platen, and a rotary carrier for holding and rotating a wafer and causing the outer surface of the wafer to make contact with the rotary polishing platen and the slurry so as to carry out chemimechanical polishing process. The pressure control circuit effects a pressure distribution on the outer surface of the wafer in accordance with polishing rates at various positions on the surface of the wafer. With this arrangement, polishing rates at different positions on the outer surface of the wafer are made to be uniform, thereby making it possible to uniformly flatten the overall outer surface of the wafer.
MOSER VITELIC INC
SIEMENS AG