Title:
CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2015026812
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a chip electronic component capable of being manufactured in a thin film to maintain a small thickness and allow miniaturization thereof and capable of preventing deterioration of efficiency due to magnetic loss even at high frequency and high current, while exhibiting high permeability, high efficiency, and a high Isat value by increasing the filling factor.SOLUTION: For a thin film inductor 10, a magnetic body 50 is formed by mixing coarse first magnetic particles 52 and fine second magnetic particles 53 formed of an amorphous metal containing iron (Fe). This results in effect of improving the filling factor, thereby significantly improving the magnetic permeability, leading to effect of increasing inductance and the Isat value.
Inventors:
RYU HAN WOOL
HWANG GWANG HWAN
LEE KWI JONG
LEE HWAN SOO
CHO HANG KYU
HWANG GWANG HWAN
LEE KWI JONG
LEE HWAN SOO
CHO HANG KYU
Application Number:
JP2014077766A
Publication Date:
February 05, 2015
Filing Date:
April 04, 2014
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01F17/04; H01F1/153; H01F1/20; H01F17/00; H01F27/24; H01F27/255; H01F41/02; H01F41/04
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Foreign References:
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Attorney, Agent or Firm:
Ryuka international patent business corporation