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Patent Searching and Data


Title:
CHIP FUSE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH02301929
Kind Code:
A
Abstract:

PURPOSE: To obtain a chip fuse with stable fusing characteristics by forming outer electrode films at the both end sections of a cylindrical body made up out of an insulating body, concurrently connecting the both ends of it with said outer electrode films, and thereby providing a soluble wire material within the cylindrical body in a non- contact condition.

CONSTITUTION: A cylindrical body made up out of an insulating body such as a sintered ceramics and the like is blocked at its both end open sections with outer electrode films made of a conductive material such as copper and the like formed at its both ends. In the cylindrical body 3, a linear soluble wire material 1 made of solder and the like, the both ends of which are connected with two each of the outer electrode films 4, is provided in a state that it is in a non-contact condition with the inner surface of the cylindrical body 3. Since the soluble wire material is in a non-contact condition with the cylindrical body, no heat is transferred to the cylindrical body side even if current to the soluble wire material 1 through the outer electrode films 4 becomes excessive so that the soluble wire material 1 is heated up. This permits the soluble wire material 1 to be throughout in a specified heat dispersing condition, thereby making it possible to hold the material in the soluble wire material 1 section.


Inventors:
BANDAI HARUFUMI
KARAKI SHINTARO
Application Number:
JP12357889A
Publication Date:
December 14, 1990
Filing Date:
May 16, 1989
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H01H85/00; H01H85/02; H01H85/044; H01H85/0445; H01H85/045; H01H85/157; (IPC1-7): H01H85/00
Attorney, Agent or Firm:
Nakajima Shiro