Title:
CHIP-LIKE ELECTRONIC COMPONENT JIG
Document Type and Number:
Japanese Patent JP2021068769
Kind Code:
A
Abstract:
To provide a chip-like electronic jig which is available in a stacked state for a plurality of stages without problem even in the case where a head of a chip-like electronic component received in a chip accommodation part protrudes from an opening of the chip accommodation part, the chip-like electronic component jig being constituted of a plurality of X-direction linear members and a plurality of Y-direction linear members.SOLUTION: A sidewall portion 15 of a chip accommodation part 13 is divided into a first sidewall portion 18 extending from the side of a first face 16 of a bottom wall portion 14 in a Z direction and defining a first space 17, and a second sidewall portion 21 extending from the side of a second face 19 of the bottom wall portion 14 in a Z direction and defining a second space 20. The first sidewall portion forms a first opening 22 communicating to the first space, and the second sidewall portion forms a second opening 23 communicating to the second space. A chip-like electronic component 12 is passed through the first opening and received in the first space and a head 24 may protrude from the first opening but the protruding head is received in the second space through the second opening in the upper-stage chip-like electronic component jig chip accommodation part.SELECTED DRAWING: Figure 3
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Inventors:
TANAKA YUTA
NAKATANI YUKIHIRO
NAKATANI YUKIHIRO
Application Number:
JP2019191599A
Publication Date:
April 30, 2021
Filing Date:
October 19, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G13/00
Attorney, Agent or Firm:
Masaaki Koshiba