Title:
CHIP MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2020047905
Kind Code:
A
Abstract:
To provide a chip manufacturing method capable of manufacturing a plurality of chips by dividing a plate-like workpiece without using an expanded sheet.SOLUTION: A chip manufacturing method includes a first laser processing step, a second laser processing step, and a dividing step. The first laser processing step forms a first modified layer by irradiating only a chip region 11c with a laser beam of a wavelength having permeability to a silicon carbide substrate along division schedule lines. The second laser processing step forms a second modified layer by irradiating a laser beam along a boundary between the chip region and an outer peripheral excess region. The dividing step divides the silicon carbide substrate into individual chips by applying force to the substrate. The dividing step divides the silicon carbide substrate into individual chips by a method for holding a plurality of portions of the silicon carbide substrate divided by one or a plurality of division schedule lines respectively by a plurality of holding parts and dividing the silicon carbide substrate along the plurality of division schedule lines by applying a force for moving the plurality of portions relatively in a direction in which they separate from each other with respect to the plurality of holding parts.SELECTED DRAWING: Figure 10
Inventors:
YODO YOSHIAKI
CHO KINEN
CHO KINEN
Application Number:
JP2018177736A
Publication Date:
March 26, 2020
Filing Date:
September 21, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B23K26/10; B23K26/53; B28D5/00; B28D7/04
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano