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Title:
CHIP MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2001259958
Kind Code:
A
Abstract:

To provide a compression molding device made by rolls of chips in large bulk, which is intertwined by winding and warping and generated in mechanical finishing.

A plurality of flanges 2 having a V-shaped notching 3 in the circumference is provided in the two rolls 1 arranged in parallel at appropriate intervals. Each of the flanges is arranged so as to fit between the flanges in the other side of the roll. These two rolls are rotated in a reverse direction each other, parts of the chips are taken in the roll by the V-shaped notching, and other parts of the chips intertwined with this are also taken therein together. These chips are compressed and molding in passing through between the two rolls. The chips between the flange and the roll are especially compressed hardly because of its narrow clearance, thereby, a formed material in a plate shape having high-strength is produced.


Inventors:
TANAKA HIROKAZU
Application Number:
JP2000080139A
Publication Date:
September 25, 2001
Filing Date:
March 22, 2000
Export Citation:
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Assignee:
AKOTA KK
International Classes:
B23Q11/00; (IPC1-7): B23Q11/00



 
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