PURPOSE: To enable only an optional chip to be easily picked up without breaking down or mis-picking up it by a method wherein an energy line source capable of irradiating the optional chip pasted part of a chip fixing tape with an energy line is provided.

CONSTITUTION: An energy line source 8 capable of irradiating the optional chip pasted part Ta of a chip fixing tape T with an energy line is provided. That is, by providing the energy line source 8 capable of irradiating the chip fixing tape T with an energy line, the chip fixing tape T can be lessened in adhesion strength without applying any force, and the energy line source 8 is so constituted so as to enable the optional chip pasted part Ta of the chip fixing tape T to be irradiated with the energy line, whereby only the chip pasted part Ta can be decreased in adhesive strength. By this setup, a chip can be protected against breakage and mis-pickup and an optional chip can be picked up easily.