Title:
CHIP SUCKING DEVICE
Document Type and Number:
Japanese Patent JPH06169001
Kind Code:
A
Abstract:
PURPOSE: To provide a sucking device capable sucking and exfoliating chips from a pressure sensitive adhesive sheet surely, without repeating an sucking miss in the case of resucking action after committing an sucking miss.
CONSTITUTION: Concerning to a chip sucking device which sucks and exfoliates chips 2 bonded to a pressure sensitive adhesive sheet 1 beforehand from the pressure sensitive adhesive sheet 1, a constant time after thrusting-up by a thrusting-up pin 3 at the time of resucking action after an sucking miss is set longer than a constant time at the time of sucking action just before the sucking miss.
Inventors:
HORIO TAKAAKI
TAKEMORI HIROSHI
NISHIZAKI MASASHI
TAKEMORI HIROSHI
NISHIZAKI MASASHI
Application Number:
JP32180192A
Publication Date:
June 14, 1994
Filing Date:
December 01, 1992
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L21/52; H01L21/67; H01L21/68; (IPC1-7): H01L21/68; H01L21/52
Attorney, Agent or Firm:
Umeda Masaru
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