Title:
CHIP-TYPE ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3528959
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a chip-type electronic component, consisting of a filling material with which the terminals on the end surfaces of the component are filled in recessed grooves, and a metal film covering the upper part of this filling materials, and to provide the manufacturing method of the electronic component.
SOLUTION: A chip-type electronic component of a structure, having increase in the quality of a metal film is formed on the terminals on the end surfaces of the component, stabilization of the quality are contrived; a conductor film will not peel off from the electronic component and will not defectively adhere to the electronic component; the adhesion of the metal film formed on the terminal parts on the end surfaces is strong; and the quality of the metal film is increased and the quality is stabilized.
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Inventors:
Ishikawa, Kazumitsu
Sakurai, Masayuki
Sakurai, Masayuki
Application Number:
JP2000235086A
Publication Date:
May 24, 2004
Filing Date:
August 03, 2000
Export Citation:
Assignee:
HITACHI AIC INC
International Classes:
H05K3/00; H01L23/12; H01L25/00; (IPC1-7): H01L23/12