PURPOSE: To provide the title compact and rear surface controllable chip type semi-fixed variable resistor having excellent packaging capacity.

CONSTITUTION: The protrusions 5c, 5d of an insulating case 5a are protruded from the surface of a metallic case 8a so as to characterize that the title resistor is engaged with the metallic case 8a excluding the protrusions 5c, 5d. Accordingly, the short-circuit due to the soldering work during the printed substrate packaging step can be avoided by protruding the insulating case 5a thereby enabling the J-lead type to be formed. Furthermore, the deformation of outer lead terminals 4a, 4b, 4c can be avoided owing to the protrusions 5c, 5d of the insulating case 5a thereby making the automatic packaging step feasible.