チップ形ウルトラキャパシタ

Japanese Patent JP7358343

B2

An energy storage apparatus suitable for mounting on a printed circuit board using a solder reflow process is disclosed. In some embodiments, the apparatus includes: a sealed housing body (e.g., a lower body with a lid attached thereto) including a positive internal contact and a negative internal contact (e.g., metallic contact pads) disposed within the body and each respectively in electrical communication with a positive external contact and a negative external contact. Each of the external contacts provide electrical communication to the exterior of the body, and may be disposed on an external surface of the body. An electric double layer capacitor (EDLC) (also referred to herein as an “ultracapacitor” or “supercapacitor”) energy storage cell is disposed within a cavity in the body including a stack of alternating electrode layers and electrically insulating separator layers. An electrolyte is disposed within the cavity and wets the electrode layers. A positive lead electrically connects a first group of one or more of the electrode layers to the positive internal contact; and a negative lead electrically connects a second group of one or more of the electrode layers to the negative internal contact.

Nicolo Branvilla
John Hyde
Wyatt Andre
Susir MJ Carabatura
Joseph Kay Rain

JP2020519291A

October 10, 2023

October 03, 2018

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FastCAP SYSTEMS Corporation

H01G11/74; H01G11/36; H01G11/54; H01G11/60; H01G11/78; H01G11/84

JP2011014859A
JP2016162993A
JP2008522410A
JP2008300692A
JP2012104571A
JP2012049507A
JP2014524146A
JP2015515741A
JP2002100411A
JP2013527628A

WO2016055908A1

Norito Yamao
Hidehiro Tokuyama

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