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Title:
CHUCK WHEEL MECHANISM FOR WORKPIECE, POLISHING DEVICE, AND CLEANING DEVICE
Document Type and Number:
Japanese Patent JP3776214
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make the draft generated in the rotation flow in the specified direction. SOLUTION: In a device, a plurality of arms 11 are radially projected from a rotational driving shaft 10, and a semiconductor wafer wf is turned by gripping the outer periphery by chuck parts 13 respectively provided on the arms 11. The arms 11 and the chuck parts 13 are formed into such a profile as to generate the down flow in which the draft to be generated in turning of the arms 11 is sucked from the outside of a chuck wheel mechanism to the rotational center side through the chuck parts 13.

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Inventors:
Masao Yoshida
Koji Ato
Fumitoshi Oikawa
Application Number:
JP23775997A
Publication Date:
May 17, 2006
Filing Date:
August 18, 1997
Export Citation:
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Assignee:
Ebara Corporation
International Classes:
B24B37/04; B24B37/30; H01L21/304; (IPC1-7): B24B37/04; H01L21/304; H01L21/304; H01L21/304
Domestic Patent References:
JP8243916A
JP7223142A
JP9094515A
JP9117857A
Attorney, Agent or Firm:
Takashi Kumagai
Yu Takagi



 
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