To provide a miniaturized circuit apparatus where quality is stabilized, and to provide a surface mounting coil.
The circuit apparatus 10A has a multilayered wiring layer. A coil wiring formed of the wiring layer patterned in a C shape forms winding of a coil. A coil 12 formed of a first wiring layer 13 and the like is formed in a part of the wiring board 11. An insulating layer whose thickness is several 50 μm to 200 μm is located between coil wiring parts. Relative positions in a thickness direction of the coil wiring parts are fixed by the insulating layer and they do not move. Thus, performance of the coil 12 formed of the coil wiring parts is stable as the coil since the coil wiring parts equivalent to winding of the coil do not move.
COPYRIGHT: (C)2008,JPO&INPIT
OSUMI KAZUNARI
SAKUMA YUKINAO
ICHIHASHI JUNICHI
| JPS61117269U | 1986-07-24 | |||
| JPH06152145A | 1994-05-31 | |||
| JPH036094A | 1991-01-11 | |||
| JPS6345879A | 1988-02-26 | |||
| JP2003059719A | 2003-02-28 |
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