Title:
回路基板の製造方法、及び回路基板の製造装置
Document Type and Number:
Japanese Patent JP6777583
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of suppressing abrasion of a die-cutting pin while suppressing defect occurrence in a ceramic green sheet.SOLUTION: The present invention relates to a manufacturing method of a circuit board comprising a ceramic layer and a wiring part that is disposed in the ceramic layer. The manufacturing method of the circuit board includes the steps of: installing a ceramic green sheet between an upper die and a lower die of a punch metal mold; arranging a resin film at a position separated upwards in relative to the ceramic green sheet between the upper die and the lower die; and opening at least one hole on the ceramic green sheet together with the film by means of the punch metal mold. In the step of opening the hole, the ceramic green sheet and the film are separated after the hole is opened.SELECTED DRAWING: Figure 1
Inventors:
Exit Western line
Yasuharu Yamada
Kazuya Nozu
Masami Hasegawa
Yasuharu Yamada
Kazuya Nozu
Masami Hasegawa
Application Number:
JP2017083788A
Publication Date:
October 28, 2020
Filing Date:
April 20, 2017
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K3/46; B32B18/00; B32B38/04; C04B35/64; H01L23/12; H05K3/00
Domestic Patent References:
| JP200632664A | ||||
| JP2005153092A | ||||
| JP2002248644A | ||||
| JP811093A | ||||
| JP4286182A | ||||
| JP4102396A | ||||
| JP4102799U |
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation