Title:
CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2013157421
Kind Code:
A
Abstract:
To provide a circuit board which achieves high heat radiation performance without losing a circuit function and causing characteristic deterioration of a circuit, and to provide a manufacturing method of the circuit board.
In a circuit board 1, a circuit pattern 13 is formed on one surface 11a of a carbon-based substrate 11 through an insulation film 12. Further, a fine irregular structure 15, having a width (a pitch) of nanometer order or sub-micrometer order and a depth of sub-micrometer order, is formed on the other surface (a heat radiation surface) 11b of the carbon-based substrate 11.
Inventors:
KOIZUMI TOMOAKI
Application Number:
JP2012016253A
Publication Date:
August 15, 2013
Filing Date:
January 30, 2012
Export Citation:
Assignee:
STANLEY ELECTRIC CO LTD
International Classes:
H05K7/20; H01L23/12; H01L23/36