Title:
CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, ELECTRONIC CIRCUIT DEVICE FOR AUTOMOBILE
Document Type and Number:
Japanese Patent JP3860425
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a small and low-cost circuit board incorporating a heat sink which is thermally stable and suitable for use with an automobile.
SOLUTION: A glass ceramics multilayer board of low sintering temperature is used for a substrate 1, and a composite material of copper/copper oxide adjustable to a linear expansion factor of the glass ceramics is used for a heat sink 2 with optimum mixing ratio. Both are simultaneously molded by sintering.
Inventors:
Kaoru Uchiyama
Yasuo Tsuji
Koji Sato
Eguchi State
Yasuo Kondo
Kiyomitsu Suzuki
Yasuo Tsuji
Koji Sato
Eguchi State
Yasuo Kondo
Kiyomitsu Suzuki
Application Number:
JP2001061505A
Publication Date:
December 20, 2006
Filing Date:
March 06, 2001
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H05K1/09; H05K3/46; H01L23/12; H01L23/36; H05K1/02; H05K1/03; (IPC1-7): H05K3/46; H01L23/12; H01L23/36; H05K1/02
Domestic Patent References:
| JP10154767A | ||||
| JP4003494A | ||||
| JP9153679A | ||||
| JP9199823A | ||||
| JP6077347A |
Attorney, Agent or Firm:
Nitto International Patent Office
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