Title:
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3492350
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make an electronic component accurately mountable on a circuit board by making the positions of alignment marks surely confirmable by improving the light transmittance of the circuit board.
SOLUTION: Firstly, sprocket holes 12 and device holes 14 are formed in a flexible, tape-like, and transparent or translucent insulating base 11. Then a conductive layer is formed by laminating a conductive material upon the surface of the insulating base 11. After the conductive layer is formed, a wiring pattern 13 and alignment marks 15 are formed by etching desired spots of the conductive layer. Then a solder resist layer 16 is formed at a spot other than the terminal sections of the wiring pattern 15 and alignment marks 15. Finally, a transparent layer 17 having a transparent or translucent surface is formed on the insulating base 11 around the alignment marks 15 so that the positions of the marks 15 may be confirmed by transmitting light through the front and rear surfaces of the circuit board. Thus, the circuit board is obtained.
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Inventors:
Katsuyoshi Kobayashi
Application Number:
JP2002110320A
Publication Date:
February 03, 2004
Filing Date:
April 12, 2002
Export Citation:
Assignee:
Shindo Electronics Co., Ltd.
International Classes:
H05K3/28; H01L21/60; H01L23/544; H05K1/02; H05K3/00; H05K1/00; (IPC1-7): H05K1/02; H01L21/60; H05K3/00; H05K3/28
Domestic Patent References:
| JP59205790A | ||||
| JP249488A | ||||
| JP5175623A | ||||
| JP263566U |
Attorney, Agent or Firm:
Shunsuke Nakao