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Title:
CIRCUIT BOARD AND METHOD FOR PACKAGING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3946200
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a fine and high-density packaging circuit board, a circuit board for inexpensively and stably packaging electronic components, and to provide a method for manufacturing the circuit board, and a method for packaging the electronic component.
SOLUTION: A metal foil 2 having different kinds of metal that becomes an etching stopper layer is prepared between a first conductive layer 3 and a second conductive layer 1. Then, a circuit wiring pattern 5 is formed on the first conductive layer 3 by etching, an adhesive insulating resin is adhered to the side of the circuit wiring pattern, the second conductive layer 1 is etched to form a projection 7, and then the layer of different kinds of metal that becomes the etching stopper is removed. For packaging electronic components on this sort of circuit board, a circuit board is prepared on the surface of the circuit board where a metal projection that does not melt even at temperature in which solder is melted is formed near an electronic component connection pad, and a gap that is equal to the height of the metal projection is formed between the circuit board and the electronic component at the metal projection, when performing the face-down packaging of the electronic component on the connection pad.


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Inventors:
Fumihiko Matsuda
Application Number:
JP2004080202A
Publication Date:
July 18, 2007
Filing Date:
March 19, 2004
Export Citation:
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Assignee:
Nippon Mektron Co., Ltd.
International Classes:
H01L23/12; H05K1/18; H01L21/60; H05K3/06; H05K3/34; (IPC1-7): H01L23/12; H01L21/60; H05K1/18; H05K3/06
Domestic Patent References:
JP11243157A
JP7074450A
JP10209220A
JP10074803A
Attorney, Agent or Firm:
Akemi Kamata



 
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