PURPOSE: To obtain a circuit board for surface mount components, wherein the arrangement order of pads on a board main body is accurately recognized and a defective place of a signal system can be easily found.

CONSTITUTION: Conductive pads 3 corresponding to a multitude of gates of surface mount components, are formed on the surface of a board main body 1, a resist layer 6 for preventing a solder from being fused is applied on the pads 3 along the edges of the pads 3 in such a way that the coating distribution form of the layer 6 is changed in each pad arranged at prescribed intervals and the differences between the fusion distribution forms of the solder, which is fused on the pads 3, are utilized as a scale, whereby the arrangement order of the gates of the surface mount components and the arrangement order of the pads 3 are accurately recognized.