Title:
接着層付き回路基板、並びに多層プリント配線板の製造方法及び多層プリント配線板
Document Type and Number:
Japanese Patent JP4639752
Kind Code:
B2
Inventors:
Daisuke Fujimoto
Yasuyuki Mizuno
Masaki Takeuchi
Katsuyuki Masuda
Kenji Takai
Yasuyuki Mizuno
Masaki Takeuchi
Katsuyuki Masuda
Kenji Takai
Application Number:
JP2004308582A
Publication Date:
February 23, 2011
Filing Date:
October 22, 2004
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H05K3/38; C09J109/00; C09J139/04; C09J147/00; C09J163/00; C09J171/00; C09J171/12; C09J179/00; C09J179/08; H01L23/12
Domestic Patent References:
| JP2001152125A | ||||
| JP2000345035A | ||||
| JP2000178446A | ||||
| JP10316754A | ||||
| JP11266083A | ||||
| JP11327135A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Ryugo Akahori
Shiro Terasaki
Ryugo Akahori