Title:
電磁波遮蔽機能を有する回路基板とその製造方法、及び、平板ケーブル
Document Type and Number:
Japanese Patent JP6671423
Kind Code:
B2
Abstract:
The present disclosure relates a printed circuit board having an EMI shielding function. In an example embodiment, the printed circuit board includes a substrate, a signal unit disposed on the substrate, a ground unit disposed in parallel with the signal unit, an insulation layer disposed above the substrate and covering the signal unit and the ground unit, an EMI shielding layer disposed on the insulation layer and under the substrate, respectively, and a shielding bridge passing through the substrate and the insulation layer at opposite sides of the signal unit and electrically connecting the EMI shielding layer disposed on the insulation layer to the EMI shielding layer disposed under the substrate.
Inventors:
Chun, Kwon-Chon
Moon, Byung Eun
Moon, Byung Eun
Application Number:
JP2018126554A
Publication Date:
March 25, 2020
Filing Date:
July 03, 2018
Export Citation:
Assignee:
INKTEC CO., LTD.
International Classes:
H05K1/02; H01B7/00; H01B7/08; H01B7/18; H01P3/08; H01P11/00; H05K3/40; H05K9/00
Domestic Patent References:
| JP2007234500A | ||||
| JP6142933B2 | ||||
| JP8506696A | ||||
| JP4313300A | ||||
| JP2014041969A | ||||
| JP9289379A | ||||
| JP2010258080A | ||||
| JP2010530690A |
Attorney, Agent or Firm:
Maeda/Suzuki International Patent Corporation