Title:
CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2021044142
Kind Code:
A
Abstract:
To provide a circuit board that can reduce the specific resistance and is less likely to be scraped or peeled off.SOLUTION: Switch patterns (circuit patterns) 18 and 21 with which a slider comes into contact are formed on a flexible insulating board 10 to form a switch board (circuit board 1). The switch patterns 18 and 21 are configured to include a first pattern p1 formed by coating a resin-contained conductive paste in which at least carbon powder is dispersed in a resin binder, and a second pattern p2 formed by coating a paste containing fine particles of metal or a metal compound on the first pattern p1 so that the paste is laminated on the upper surface of the first pattern p1 and heating the coated paste on the first pattern p1 to fuse and bond fine particles of the metal or fine particles of the metal precipitated from the metal compound to one other.SELECTED DRAWING: Figure 3
Inventors:
HIRAYAMA YUYA
FUJIMAKI MASAFUMI
SUYAMA MASAHITO
FUJIMAKI MASAFUMI
SUYAMA MASAHITO
Application Number:
JP2019165087A
Publication Date:
March 18, 2021
Filing Date:
September 11, 2019
Export Citation:
Assignee:
TEIKOKU TSUSHIN KOGYO KK
International Classes:
H01H1/06; H01H19/08
Attorney, Agent or Firm:
Yu Takagi
Takashi Kumagai
Takashi Kumagai