Title:
高熱伝導性発光素子用回路部品及び高放熱モジュール
Document Type and Number:
Japanese Patent JP4085917
Kind Code:
B2
Inventors:
Baba Daizo
Takayoshi Ozeki
Takayoshi Ozeki
Application Number:
JP2003275666A
Publication Date:
May 14, 2008
Filing Date:
July 16, 2003
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
H01L23/36; H01L33/60; H01L33/62; H01L33/64
Domestic Patent References:
| JP2003163381A | ||||
| JP2003168828A | ||||
| JP11307820A | ||||
| JP2000244022A | ||||
| JP2000101149A | ||||
| JP2002094122A | ||||
| JP2003008074A | ||||
| JP2001203396A | ||||
| JP2000353826A | ||||
| JP2003218398A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori