Title:
回路接続材料並びに回路端子の接続構造及び接続方法
Document Type and Number:
Japanese Patent JP5120515
Kind Code:
B2
Abstract:
A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
Inventors:
Izuo Watanabe
Mitsugu Fujinawa
Yasuhiro Arifu
Tomoko Kanazawa
Atsushi Kuwano
Mitsugu Fujinawa
Yasuhiro Arifu
Tomoko Kanazawa
Atsushi Kuwano
Application Number:
JP2012078290A
Publication Date:
January 16, 2013
Filing Date:
March 29, 2012
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J201/06; C09J4/02; C09J7/00; C09J11/04; C09J11/06; C09J157/00; C09J171/10; H01B1/20; H01B1/22; H01L21/60; H01L23/29; H01R11/01; H05K3/32; C08K5/14; C08K5/521; C08L9/02; C08L13/00; C08L21/00
Domestic Patent References:
| JP995652A | ||||
| JP8325543A | ||||
| JP9291259A | ||||
| JP6295617A | ||||
| JP10273626A | ||||
| JP10273630A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Masato Ikeda
Yoshinori Shimizu
Junichiro Sakamaki
Masato Ikeda