Title:
回路接続材料及びそれを用いた回路板の製造方法、回路板
Document Type and Number:
Japanese Patent JP4590732
Kind Code:
B2
Inventors:
Yasuhiro Arifu
Izuo Watanabe
Koji Kobayashi
Mitsugu Fujinawa
Takashi Nakazawa
Kojima Kura
Izuo Watanabe
Koji Kobayashi
Mitsugu Fujinawa
Takashi Nakazawa
Kojima Kura
Application Number:
JP2000399825A
Publication Date:
December 01, 2010
Filing Date:
December 28, 2000
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J9/02; H01B1/20; C09J175/14; C09J179/08; H01L21/60; H05K3/32; H05K3/36
Domestic Patent References:
| JP6287523A | ||||
| JP11260517A | ||||
| JP62141083A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Yoshinori Shimizu