Title:
CIRCUIT CONNECTION MATERIAL, CONNECTION STRUCTURE AND METHOD OF CIRCUIT TERMINAL
Document Type and Number:
Japanese Patent JP3885351
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electric/electronic circuit connection material which is higher in low-temperature curing rate, has a longer serviceable life, and causes less corrosion damages to the circuit than the conventional epoxy resin.
SOLUTION: This material is interposed between the opposite facing circuit electrodes, and the opposite facing circuit electrodes are pressed against each other to be electrically connected together with the material. The material comprises (1) a curing agent which generates free radicals through heating, (2) hydroxyl group-containing resin whose molecular weight is higher than 10,000, (3) a radical polymerization material, and (4) diaryl bisphenol A as essential components.
Inventors:
Mitsugu Fujinawa
Izuo Watanabe
Yasuhiro Arifu
Tomoko Kanazawa
Izuo Watanabe
Yasuhiro Arifu
Tomoko Kanazawa
Application Number:
JP8747998A
Publication Date:
February 21, 2007
Filing Date:
March 31, 1998
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/60; C08K5/134; C08K5/14; C08L101/06; (IPC1-7): H01L21/60; //C08K5/134; C08K5/14; C08L101/06
Domestic Patent References:
| JP2132114A | ||||
| JP9169958A | ||||
| JP61296077A | ||||
| JP8325543A | ||||
| JP2022314A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Ryugo Akahori
Shiro Terasaki
Ryugo Akahori
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