Title:
回路接続材料及び接続体
Document Type and Number:
Japanese Patent JP5867508
Kind Code:
B2
Inventors:
Naoto Kudo
Kazuya Matsuda
Mitsugu Fujinawa
Kazuya Matsuda
Mitsugu Fujinawa
Application Number:
JP2013532350A
Publication Date:
February 24, 2016
Filing Date:
September 06, 2011
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J175/04; C09J4/06; C09J9/02; C09J11/06; C09J129/14; C09J167/00; C09J171/10; C09J177/00; C09J179/08; H01B1/22; H01L21/60
Domestic Patent References:
| JP2006199825A | ||||
| JP2009203262A | ||||
| JP9118860A | ||||
| JP10273633A | ||||
| JP2006124531A | ||||
| JP2011116968A | ||||
| JP2010278324A |
Foreign References:
| WO2010024087A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Hideki Okita
Yoshinori Shimizu
Tomoya Furoshita
Hideki Okita