Title:
回路接続ペースト材料
Document Type and Number:
Japanese Patent JP4824876
Kind Code:
B2
Inventors:
Koji Paddy
Murata Tatsuji
Makoto Nakahara
Takatoshi Kira
Daisuke Ikesugi
Murata Tatsuji
Makoto Nakahara
Takatoshi Kira
Daisuke Ikesugi
Application Number:
JP2001233418A
Publication Date:
November 30, 2011
Filing Date:
August 01, 2001
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
Sharp Corporation
Sharp Corporation
International Classes:
C08G59/50; H01L21/60; C09J11/06; C09J133/08; C09J151/00; C09J163/00; C09J183/04; C09J183/10; H05K1/14
Domestic Patent References:
| JP2003045235A | ||||
| JP2000345010A | ||||
| JP10008006A |
Attorney, Agent or Firm:
Keiichiro Saikyo