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Title:
回路装置
Document Type and Number:
Japanese Patent JP5658429
Kind Code:
B2
Abstract:
A circuit device, includes a semiconductor substrate, and a first inductor provided over said semiconductor substrate, and a first interconnect provided over said semiconductor substrate and coupled with first inductor.

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Inventors:
川野 連也
中柴 康隆
Application Number:
JP2008174111A
Publication Date:
January 28, 2015
Filing Date:
July 03, 2008
Export Citation:
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Assignee:
ルネサスエレクトロニクス株式会社
International Classes:
H01L21/822; H01F17/00; H01F19/00; H01F19/04; H01L27/04; H05K1/02
Attorney, Agent or Firm:
Shinji Hayami



 
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