Title:
【発明の名称】配線パターン検査装置
Document Type and Number:
Japanese Patent JP2737467
Kind Code:
B2
Abstract:
PURPOSE:To realize an excellent wiring-pattern inspecting apparatus which can extract the shape feature of the wiring pattern by a simple mask scanning without repeated processing of expansion, contraction and thinning of wire for the binary-coded image of the wiring pattern and can detect the defects such as wire breakdown, short circuits, short wire width and poor classification. CONSTITUTION:The binary-coded image of a printed wiring pattern is scanned with an MXN window scanning means 105 for every one pixel. The operations for AND and OR are performed with a logic operating means 106 at each row in the horizontal direction and each colimn in the vertical direction in the concentric region within the same window. The shape features which are projected in the horizontal direction and the vertical direction are extracted. Furthermore, the OR operation of the result of the AND is performed. The amount of the feature indicating the cetner of the wiring pattern is extracted. Various kinds of detects can be detected on the central line of the wiring pattern by one mask scanning because the shape and the position of the pattern are judged with the combination of the amounts of the features.
Inventors:
YAMAMOTO ATSUHARU
KANEKO TADASHI
KANEKO TADASHI
Application Number:
JP22262891A
Publication Date:
April 08, 1998
Filing Date:
September 03, 1991
Export Citation:
Assignee:
MATSUSHITA DENKI SANGYO KK
International Classes:
G01B11/24; G01N21/88; G01N21/956; G03F1/84; G06T1/00; G06T7/00; H05K3/00; (IPC1-7): G01N21/88; G01B11/24; G03F1/08; G06T7/00; H05K3/00
Domestic Patent References:
| JP6319541A | ||||
| JP3229373A |
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)