Title:
CIRCUIT SUBSTRATE FOR SEMICONDUCTOR AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0567852
Kind Code:
A
Abstract:
PURPOSE: To enhance the signal transfer characteristics while reducing the crosstalk in the circuit substrate for semiconductor using ceramic sheet.
CONSTITUTION: Signal wiring layers 22 are formed between multilayer structured ceramic sheets 21A, 21B. These signal wiring layers 22 are formed in the semi- circular recessions 23 formed in one surface of the ceramic sheet 21A. Furthermore, a grounding conductor layer 24 is also formed in the recessions 25 having specific curvature formed on the other surface of the ceramic sheet 21A. Through these procedures, the signal transfer characteristics can be enhanced while reducing the crosstalk.
Inventors:
HIRANO NAOHIKO
Application Number:
JP22166091A
Publication Date:
March 19, 1993
Filing Date:
September 02, 1991
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L23/12; H05K1/02; H05K3/46; H05K1/00; H05K1/03; (IPC1-7): H01L23/12; H05K1/02; H05K3/46
Attorney, Agent or Firm:
Takehiko Suzue
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