Title:
CIRCUIT SUBSTRATE WITH CAPACITOR AND MULTILAYER CIRCUIT SUBSTRATE WHEREIN THE CIRCUIT SUBSTRATE IS USED
Document Type and Number:
Japanese Patent JPH08125302
Kind Code:
A
Abstract:
PURPOSE: To provide a circuit substrate with a print capacitor which enables an increase in capacity of a print capacitor formed on a printed substrate.
CONSTITUTION: A copper clad lamination board 1 is used as an insulation substrate. A first electrode 2a of a print capacitor 3 is formed of cooper foil on a surface of a copper clad lamination board. A dielectric layer 4a is formed on the first electrode 2a by using dielectric paste and a second electrode 5a is formed on the dielectric layer 4a by using conductive paint.
Inventors:
ISHIYAMA ICHIRO
NAGARE ICHIRO
KUROKAWA HIROYUKI
KATO MASAKI
AZUMA KOJI
NOMURA KAZUO
NAKANUMA NOBUTSUGU
NAGARE ICHIRO
KUROKAWA HIROYUKI
KATO MASAKI
AZUMA KOJI
NOMURA KAZUO
NAKANUMA NOBUTSUGU
Application Number:
JP25525294A
Publication Date:
May 17, 1996
Filing Date:
October 20, 1994
Export Citation:
Assignee:
HOKURIKU ELECT IND
International Classes:
H05K1/16; H05K3/46; (IPC1-7): H05K1/16; H05K3/46
Attorney, Agent or Firm:
Hidetoshi Matsumoto (1 outside)
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