Title:
CIRCUIT SUBSTRATE
Document Type and Number:
Japanese Patent JP2001160663
Kind Code:
A
Abstract:
To provide a circuit substrate which reduces EMI noise emitted from above the circuit substrate and reduces noise intermixes from outside.
A circuit substrate 10 provided with electrical components on the surface or reverse side thereof, comprises a ground layer 12 on the surface and a ground layer 14 on the reverse. Further, signal layers 18, 22 are located between the ground layers 12, 14.
Inventors:
ABE TAKASHI
Application Number:
JP34395599A
Publication Date:
June 12, 2001
Filing Date:
December 02, 1999
Export Citation:
Assignee:
NEC CORP
International Classes:
H05K1/11; H01L23/552; H01L23/58; H05K1/02; H05K3/46; H05K9/00; (IPC1-7): H05K1/02; H05K3/46; H05K9/00
Attorney, Agent or Firm:
Nobuo Takahashi (3 outside)
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