埋込み周囲電極マイクロキャビティプラズマデバイスアレイ、電気的相互接続及び形成方法

Japanese Patent JP5399901

B2

In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.

Eden, Gary Jay
A park, Sun * gin
Kim, クウォン * Soe

JP2009521805A

January 29, 2014

July 24, 2007

Click for automatic bibliography generation  

ザボード オブ a truss -- ティーズ オブ ザユニ bar city オブ Illinois

H01J11/16; H01J9/02; H01J17/49

Mitsuru Kimura
Takanori Menju
Taiji Morikawa
Yasuhito Amemiya
Kei Sakurada
Field Yasuyuki

Previous Patent: METHOD OF PRINTING KIND OF ODDDLOT STOCK CERTIFICATE AND ARRANGING IT

Next Patent: JPS5399902