To provide a cleaning arrangement of a semiconductor substrate capable of surely preventing contamination of a wafer by detecting the fact that a contaminant has entered a cleaning liquid.
The cleaning arrangement for a semiconductor substrate cleans the semiconductor substrate using a cleaning liquid. It comprises the cleaning liquid, a control means for controlling a cleaning process of the semiconductor substrate with the cleaning liquid, a detecting means which detects occurrence of air bubbles from the surface of semiconductor substrate that contacts the cleaning liquid, and a cleaning process stop control means which, if the detecting means detects occurrence of air bubbles, controls stopping of the cleaning process and controls interruption of the cleaning process of the semiconductor substrate which is not yet cleaned.
TAMAI HIDEYUKI
YAMAMOTO KAZUHIKO
MURAOKA SHUNICHI
YOSHIDA MASANORI
SAKAGAMI TAKUYA
Next Patent: METHOD AND DEVICE FOR EXPOSURE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE