Title:
洗浄用組成物及びＣＭＰ後の半導体ウエハーの洗浄方法
Document Type and Number:
Japanese Patent JP6800411
Kind Code:
B2
Abstract:
The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains one or more quaternary ammonium hydroxides, one or more organic amines, one or more metal inhibitors, and water. The invention also provides methods for using the cleaning composition.
Inventors:
Roman Ivanov
Fernando Hun
Kochen-Yuen
Fred sun
Fernando Hun
Kochen-Yuen
Fred sun
Application Number:
JP2017536832A
Publication Date:
December 16, 2020
Filing Date:
January 12, 2016
Export Citation:
Assignee:
CMC Materials, Incorporated
International Classes:
H01L21/304; C11D7/26; C11D7/32
Domestic Patent References:
| JP2007016232A | ||||
| JP2014170927A |
Foreign References:
| WO2013173743A2 | ||||
| US20140076365 | ||||
| WO2014168166A1 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Jun Tsuruta
Tomohiro Minamiyama
Yoichi Watanabe
Naori Kota
Kenji Kimura
Shinji Mitsuhashi
Jun Tsuruta
Tomohiro Minamiyama
Yoichi Watanabe
Naori Kota
Kenji Kimura