Title:
CLEANING LIQUID OF INTEGRATED CIRCUIT DEVICE, AND CLEANING METHOD USING CLEANING LIQUID
Document Type and Number:
Japanese Patent JP2005142559
Kind Code:
A
Abstract:
To provide a cleaning liquid of an integrated circuit device formed on a wafer which shall be cleaned, and a cleaning method using the cleaning liquid.
The cleaning liquid cleans an integrated circuit device which comprises a low cellularity detergent, metal corrosion inhibitor, acid pH modifier or alkaline pH modifier, and water. When a metal substance like tungsten is introduced into a manufacturing process of gate line, the cleaning liquid relating to this invention can be employed in a cleaning process for removing particles which is executed after forming gate line pattern thereby.
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Inventors:
BUN SHOSHO
CHOI SANG-JUN
HONG CHANGKI
CHOI SANG-JUN
HONG CHANGKI
Application Number:
JP2004314668A
Publication Date:
June 02, 2005
Filing Date:
October 28, 2004
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
C11D1/72; C11D3/00; C11D3/02; C11D3/04; C11D3/16; C11D3/20; C11D3/30; C11D3/34; C11D11/00; C11D17/08; C23G1/18; H01L21/304; (IPC1-7): H01L21/304; C11D1/72; C11D3/04; C11D3/20; C11D3/30; C11D3/34; C11D17/08; C23G1/18
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro